Thermal Analysis
Thermal analysis (also called heat transfer analysis or thermal simulation) is the CAE technique for predicting temperature distribution within a design, heat flow rates, and thermal stresses (stresses caused by uneven heating or cooling). Thermal analysis solves the heat diffusion equation across a 3D domain, accounting for conduction, convection, and radiation, to predict hot spots, temperature gradients, and the risk of thermal warping or failure.
Why it matters
Products that experience high temperatures (engines, power electronics, industrial furnaces) or rapid temperature changes (aerospace components, thermal cycling equipment) must be validated thermally, or they will fail in the field. Thermal analysis also predicts thermal stress — the mechanical stress caused by differential heating — which can cause distortion, cracking, or fatigue failure independent of mechanical loading. Understanding thermal-structural coupling (how temperature affects mechanical strength) is essential for many products.
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Cite this definition
Finocchiaro, Michael. “Thermal Analysis.” DemystifyingPLM PLM Glossary, 2026, https://www.demystifyingplm.com/glossary/thermal-analysis